IRT Nanoelec and MPW (Multi Project Wafer) recently signed a partnership agreement for silicon photonic circuit fabrication—the first partnership of its kind anywhere in the world.
The silicon photonic circuits will be fabricated on 200 mm SOI wafers with a 310 nm silicon layer.
The partnership is expected to result in high-density miniaturized components at reasonable fabrication cost.
The circuits will meet current market demand and new optical switching needs for computing centers and any emerging uses requiring high computing capacity and processing speeds.
The project encompasses wafer manufacturing, design kits (including modelling and verification tools), and the use of new technologies like 3D integration.