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IRT Nanoelec News

Heterogeneous Integration with Collective Die-to-wafer Hybrid and Fusion Bonding Demonstration

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EV Group, a core partner of Nanoelec consortium, successfully demonstrates end-to-end process flow for collective die-to-wafer bonding with sub-two-micron placement accuracy, (see PR in last october). This breakthrough represents an important milestone in accelerating the deployment of heterogeneous integration in next-generation 2.5D and 3D semiconductor packaging. Such technologies are required for leading-edge applications such as artificial… Lire la suite » ... Read more »

Accurate occupancy data assist smart building management

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STMicroelectronics, Schneider Electric and Lynred presented the first integration of Edge AI in a high-performance people-counting sensor developed in the frame of Nanoelec in November 2020. While monitoring occupancy in large spaces with multiple entrances and exits is a significant challenge in any closed environment, it potentially provides significant value to hotels, offices, retail businesses… Lire la suite » ... Read more »

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