Expert from 3D integration program to contribute to ECTC conference

Stéphane Moreau, a reliability engineer for the IRT Nanoelec 3D integration program, recently joined the IEEE EPS Reliability Technical Committee, which plays a major role in developing roadmaps for circuit reliability criteria.

Stéphane was already a member of the ITRS committee on the same topic.

As a member of the Committee, he will contribute his insights, including those gained from research at IRT Nanoelec.