Best Paper Award at ESTC 2016 (Electronics System Integration Technology Conference)

The paper “Packaging of high speed 100 Gbps silicon photonic photoreceiver module using 50 μm pitch microbump Flip-Chip and Chip-On-Board approach” co-authored by Olivier Castany, Benjamin Blampey, Benoit Charbonnier, Gabriel Pares, Maxime Germain, Isabelle Borel, Stephane Malhouitre, Christophe Kopp, and Stephane Bernabe (Grenoble Alpes University, CEA Leti); and Enrico Temporiti (STMicroelectronics) won the Best Paper Award at IEEE ESTC 2016 (Electronics System-Integration Technology Conference) held on September 13–15 at the Grenoble World Trade Center.

The award is one worth winning! More than 450 people attended the conference—Europe’s biggest packaging event ( It is also the first high-level packaging, 3D integration, and interconnect-community award bestowed upon research conducted under the IRT Nanoelec Silicon Photonics program.