IRT Nanoelec partner Mentor Graphics wins award

“For the third-year in a row, Mentor, a Siemens business won 3DInCites’ EDA Supplier of the Year Award. 3DInCites is a publication dedicated to coverage of the 2.5/3D IC industry. The award is not only for the products Mentor creates for companies designing and manufacturing 2.5/3D ICs, but is also for Mentor’s efforts to grow… Lire la suite » ... Read more »

IRT Nanoelec joins EARIV

IRT Nanoelec has joined EARIV, the European Analytical Research Infrastructures Village. IRT Nanoelec and its PAC-G platform for advanced characterization in Grenoble have joined the European Analytical Research Infrastructures Village to promote access to Europe’s research infrastructures—which include some of the most advanced instruments in the world—by businesses. The initiative was unveiled at #RISofia2018 to… Lire la suite » ... Read more »

Stéphane Moreau joins ITRS 2.0 working group on electromigration in heterogeneous integrations

Stéphane Moreau, a researcher at IRT Nanoelec partner Leti, has joined the ITRS 2.0 committee. Stéphane will contribute his in-depth knowledge of electromigration issues arising from heterogeneous 3D integrations (the three-dimensional packaging of single and multiple chips). His experience developing technology under the IRT Nanoelec 3D Integration program will be crucial to the International Technology… Lire la suite » ... Read more »

IRT Nanoelec attends inter-IRT meeting on artificial intelligence

The meeting, held on March 20 in Paris, is part of a strategy to develop an inter-IRT initiative on artificial intelligence, with the ultimate goal of supporting enterprises in order that they integrate this technology into their products and services. Artificial Intelligence (AI) can be used across virtually all industries, with applications in transportation, healthcare,… Lire la suite » ... Read more »

Leti’s silicon photonics research presented at OFC 2018

The Optical Fiber Conference (OFC) was held in San Diego, California on March 13–15, 2018. OFC is the world’s leading optical telecom and datacom event. With more than 700 exhibitors and 15,000 attendees, this event is important to IRT Nanoelec, as it provides a unique opportunity to promote our technologies and our silicon photonics  open… Lire la suite » ... Read more »

IRT Nanoelec kicks off new Power GaN program

Power electronics components use electronic systems to convert and conditioning electricity. Switches, high-frequency transformers, inverters, and converters are a few examples of power electronics systems. Power electronics is a key enabling technology to efficiently use, distribute and generate electrical energy. The new PowerGaN program will develop a new key enabling technology for semiconductor power components… Lire la suite » ... Read more »

The three-question interview with Jean-Louis Gentner, CEO, Almae Technologies

  You recently became an IRT Nanoelec partner. Tell us about your company.  Almae Technologies was founded in early 2016 as a spinoff of the III–V Lab to develop and commercialize laser components and integrated laser-modulators to meet the needs of the telecom and datacom markets, mainly. The first components we released were for fiber-to-the-home… Lire la suite » ... Read more »

IRT Nanoelec conference: Nanoelectronics for new building services

  IRT Nanoelec partners attended the latest IRT Nanoelec conference. The conference provided an update on our studies of new building services conducted under the PULSE program. The Activage project, presented by the CEA, will implement and experiment with connected solutions for assisted living. The project also includes acceptability studies,  implementation and business models for… Lire la suite » ... Read more »

IRT Nanoelec attends SIdO 2018 Internet of Things trade show

For the second year in a row, IRT Nanoelec attended SIdO, a major IoT trade show held in Lyon on April 4 and 5. SIdO is like France’s very own CES, with more than 350 exhibitors, 6,900 industry professionals, more than 7,500 visitors, and more than 200 startups promoting their IoT solutions for all markets…. Lire la suite » ... Read more »

IRT Nanoelec attends 6th 3D TSV Summit

The 6th edition of Semi Europe’s 3D TSV Summit was held on January 22 to 24 in Dresden, Germany. It was attended by more than 170 3D integration and assembly experts. The participants included major technology stakeholders like Intel, Qualcomm, STMicroelectronics, and GlobalFoundries. IRT Nanoelec partners CEA-Leti and STMicroelectronics, as well as Mentor Graphics and… Lire la suite » ... Read more »